3D Inspection Equipment Comprehensive Catalog
Using cutting-edge optical application technology! A lineup including inline bump inspection equipment.
This catalog introduces inspection equipment that meets our customers' needs. We feature the "TVI Series," which achieves three-dimensional measurement that follows the state of the circuit board storage in a unique way, and the "CVI Series," which enables high-speed individual board inspection while maintaining high-precision inspection performance. Our products utilize a unique confocal optical sensor, achieving high speed that allows for inline measurement by reducing measurement time. 【Contents Included】 ■ In-tray type inline bump inspection equipment ■ Index type inline bump inspection equipment ■ Inline bump inspection equipment ■ Temperature-variable warpage inspection equipment ■ Multi-beam confocal sensor ■ Three-dimensional sensor specifications *For more details, please refer to the PDF document or feel free to contact us.
- Company：東光高岳 光応用検査機器事業本部 検査機器営業部 営業G
- Price：Other
